Hsiuping University of Science and Technology Institutional Repository : Item 310993100/1387

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HUSTIR > College of Engineering > Department of Electronic Engineering > Journal > Item 310993100/1387

Please use this identifier to cite or link to this item: http://ir.hust.edu.tw/dspace/handle/310993100/1387

Title:	Evaluation of single- and multilayered amorphous tantalum nitride thin films as diffusion barriers in copper metallization
Authors:	G. S. Chen;S. T. Chen;L. C. Yang;P. Y. Lee
Date:	2000
Issue Date:	2009-02-03T07:01:33Z
Relation:	J. Vac. Sci. Technol. A, 18, pp. 720?723. (SCI)
Appears in Collections:	[Department of Electronic Engineering] Journal

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